Renesas Ships Sample SH-Mobile G2 Chips
Renesas Technology Corp. today announced that it has begun shipping samples of the SH-Mobile G2, a single-chip LSI for dual-mode HSDPA/W-CDMA and GSM/GPRS/EDGE mobile phones. The LSI was jointly developed with NTT DoCoMo, Inc., Fujitsu Limited, Mitsubishi Electric Corporation, and Sharp Corporation, and evaluation samples have been shipped to these handset manufacturers since the end of September 2006. Renesas plans to begin volume production of the SH-Mobile G2 in the third quarter of 2007 and will offer the W-CDMA mobile phone platform worldwide to W-CDMA and FOMA handsets.