CDMA
CDMA

CDMA

Will it be SanyoKia or Nokia-San?

Will it be SanyoKia or Nokia-San? by Mobikyo KKLast week’s announcement of Nokia and Sanyo joining forces to boost their combined CDMA market share in the US was lost in the next-gen mobile TV hype and media avalanche (not to mention complaints about pokey dial-up access from the venue) coming from the 3GSM World Congress. The Nokia-Sanyo combination is an obvious play with both sides bringing a decent value proposition to the table; Nokia has massive manufacturing capacity, established distribution channels and a global brand while Sanyo has proven experience producing ultra-cool high-tech handsets and strong operator/vendor relationships. The companies gave no financial details of the tie-up, which is expected to close in the second quarter, but the JV will be based in Osaka and San Diego with an estimated 3,500 employees.

The challenge — and rewards — of morphing these respective ‘best of’ brands into a unified product offering are significant. Sanyo has advanced mobile battery and GPS chip expertise that even a Nokia would be hard-pressed to build on their own and such technologies are fast becoming key competitive differentiators as the US (and other markets) mandate emergency location reporting and other public safety services. Sanyo was vaulted to the ranks of top-tier suppliers to national champion DoCoMo last year as the name behind some of Big D’s first GPS-enabled models, the SA800i and SA700iS.

A Nokia-Sanyo tie-up makes sense from an economy of scale perspective and the end result should be better hardware for the end user, potentially at a lower price, which should please the operators and — more to the point — their shareholders.

DoCoMo Announces Nokia 3G Phone

DoCoMo announced today they will start selling the 3G FOMA NM850iG handset, made by Nokia [ .jpg image ], which works on DoCoMo’s 3G FOMA network in Japan and W-CDMA, GSM and GPRS networks overseas where DoCoMo’s global roaming services are available, beginning February 24, 2006. Application to DoCoMo’s WORLD WING 3G roaming service is required to use the handset overseas for voice calls, i-mode, videophone and short messaging service (SMS).The handset connects wirelessly with Bluetooth devices, including PCs for data synchronization and connection to the Internet.

Sanyo and Nokia to JV for U.S.

Sanyo Electric Co. has reached a basic agreement with Finland’s Nokia Corp. to set up a 50-50 joint venture in the US as early as next autumn to make 3G mobile phones, the Nihon Keizai Shimbun reported without citing sources. The new joint venture, which will likely be located in San Diego will produce CDMA2000 3G cell phones, the business daily said. For Nokia, the joint venture will likely help it absorb Sanyo’s know-how, particularly in the development of thin handsets, according to the report.

Freescale RF Technology to Further Reduce Size and Cost of 3G Handsets

Freescale Semiconductor is developing a highly integrated, single chip RF solution for 3G mobilephones. Targeted for the Japan market, this RF solution supports tri-band WCDMA and quad-band GSM/GPRS/EDGE. The RF solution is based on Freescale’s advanced 90nm RF CMOS process technology and delivers an antenna-to-bits functionality in asingle chip. Additionally, it is capable of meeting Category 8 HSDPAand HSUPA requirements.

Global 3G Platform Announced

NTT DoCoMo, Inc., Renesas Technology Corp., Fujitsu Limited, Mitsubishi Electric Corporation and Sharp Corporation today announced that they will jointly develop a comprehensive mobile phone platform combining a single-chip LSI for dual mode handsets supporting HSDPA /W-CDMA and GSM/GPRS/EDGE, and core software such as operating systems. The new mobile phone platform will help accelerate the global adoption of W-CDMA services including FOMA, and lower the costs of these handsets. The companies expect to have the platform developed around Q2/FY2007 (July-September).

QUALCOMM Enhances Deployment of Location Services for WCDMA

QUALCOMM announced that it has streamlined the deployment process for providing location services on WCDMA (UMTS)/HSDPA/GSM/GPRS/EDGE networks around the world. Open Mobile Alliance (OMA) Secure User Plane for Location (SUPL) 1.0 software is now offered broadly across QUALCOMM’s WCDMA (UMTS) portfolio of Mobile Station Modem (MSM) chipsets as part of the gpsOne solution, offering a consistent platform for the rollout of Assisted-GPS (A-GPS) technology and the location services it enables. Support for the OMA SUPL 1.0 protocol, accepted industry-wide, delivers significant cost-efficiency benefits for network operators deploying location services and offers wireless users a seamless experience when roaming onto other WCDMA (UMTS)/HSDPA and GSM/GPRS/EDGE networks.