Global 3G Platform Announced
NTT DoCoMo, Inc., Renesas Technology Corp., Fujitsu Limited, Mitsubishi Electric Corporation and Sharp Corporation today announced that they will jointly develop a comprehensive mobile phone platform combining a single-chip LSI for dual mode handsets supporting HSDPA /W-CDMA and GSM/GPRS/EDGE, and core software such as operating systems. The new mobile phone platform will help accelerate the global adoption of W-CDMA services including FOMA, and lower the costs of these handsets. The companies expect to have the platform developed around Q2/FY2007 (July-September).
The next-generation mobile phone platform is built on the previously developed single-chip LSI technology of NTT DoCoMo and Renesas since July 2004, which combines a baseband processor and the SH-Mobile application processor for dual-mode W-CDMA and GSM/GPRS phones. The jointly developed platform adds new functionality, such as support for HSPDA and EDGE technologies and full development support including OS, middleware and drivers.
The platform can be implemented directly as a base system for W-CDMA handsets and eliminates the need for mobile phone manufacturers such as Fujitsu, Mitsubishi Electric and Sharp to develop a separate system for the common handset functions significantly reducing the time and cost of development. At the same time, it allows them to invest more time and resources into developing handsets that are distinctive to them. Full Press Release Here