Toshiba has announced the latest addition to its line-up of Dynastron complementary metal oxide semiconductor (CMOS) image sensors for integration in mobile handsets. The new ET8E99-AS [ .jpg image ] brings 3.2-megapixel capability to cellular phones and other camera-enabled mobile devices in a small package, offering, according to the company, low-power consumption and high-level performance. Samples of the new sensor are available immediately and mass production will start within the calendar year. The ET8E99-AS will be exhibited at CEATEC JAPAN 2005, from October 4 at Makuhari Messe.
The new sensor offers an optimized balance between size and performance. The 3.2 megapixel count is achieved in a small 1/2.6-inch optical format by reducing pixel pitch from 3.75 to 2.7 microns, while maintaining a pixel size sufficient to record detailed, high-resolution images. The sensor also offers low power consumption, smearless imaging and high-speed operation, all key requirements for such mobile equipment as camera phones and PDAs.
Alongside the growing popularity of camera phones, demand is growing for improved image quality, without any increase in phone size. The launch of the 3.2-megapixel ET8E99-AS positions Toshiba to provide leading-edge support such for phone manufacturers. The Company expects the new device to reinforce its leadership in CMOS imaging.
Pricing and Availability:
Samples of ET8E99-AS are immediately available at a unit price of 5,000 yen. Mass-production will begin at the end of 2005 at a monthly output of 300,000 or more.
1. In video mode, the new sensor offers a high speed frame rate of 15 frames per second (fps) at QXGA output and 30fps at 3-to-1 vertical pixel binning.
2. The new sensor incorporates automatic blemish correction and detection, gain control and lens shading compensation, supporting simplified design of an optimized camera system
3. A flexible input clock is supported by incorporation of a Phase Locked Loop (PLL) circuit.
Part Number: ET8E99-AS
Optical Format: 1/2.6-inch
Pixel Count: 2,080 (H) x 1,560 (V) (Max.)
Cell Size: 2.7 um (H) x 2.7um (V)
Output Signal: RAW data: 12bit parallel/subLVDS (serial)
Clock Frequency: 6-20MHz
Fame Rate: 15 frames per second (fps) at QXGA output
30fps at 3-to-1 vertical pixel binning
Interface Control: I2C bus
Power Supply: 1.5V (digital), 2.8V (analog, I/O)
Power Consumption: 240mW (at 15fps QXGA output)
Operating Temperature: -20?? to 60??C