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  • Intel Japan Ships Sample 3G Chips

    Intel Corp’s Japanese unit said on Thursday it expected to supply a chip that combines communications, software applications and memory functions in a single piece of silicon for use in NTT DoCoMo Inc’s 3G phones as early as the end of 2004. The new chip, which is expected to be cheaper, more energy efficient and occupy less space than the separate chips currently used in 3G mobile phones.

    “We have already shipped samples and we expect them to be used in DoCoMo 3G mobile phones as early as this fall or maybe early 2005,” Kaz Yoshida, representative director and co-president of the Intel KK, the Japan unit of the U.S. microchip maker, told Reuters. Continue >>

    Posted: 15 January 2004 | Filed: Terminal Technology, Wireless News | Feedback | Print |
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