TTPCom and NEC Collaborate to Develop Dual-mode 3G/2G Chips
TTP Communications and NEC Electronics Corporation, the leader in single-mode (W-CDMA) 3G baseband chips in Japan, today announce that they are joining forces to develop dual-mode chips that will include TTPCom Limited’s EDGE/GPRS/GSM silicon and software architecture. This fast-track route to the development of 3G/2G chips will help NEC Electronics increase its presence in the global market. NEC Electronics is developing a dual-mode 3G/2G chipset to address the growing world market for dual-mode wireless products that can handover to EDGE/GPRS/GSM networks outside pockets of 3G coverage.
“NEC Electronics is one of the leading developers of 3G technology in the world and we are therefore particularly pleased that we are working with them to incorporate our 2G/2.5G architecture into their dual-mode chips,” stated Julian Hildersley, Managing Director of TTPComfs Silicon Business Unit. “TTPCom has long recognised the pressure on R&D budgets in the wireless industry and its objective in silicon is to deliver stable solutions that save time and money by allowing customers to focus their R&D efforts on their strongest differentiators, and employ TTPCom’s solutions when time-to-market is most important.”
“TTPCom’s GSM/GPRS technology has become an industry standard, and the company is one of only a few companies to offer an effective EDGE solution today,” stated Masakazu Yamashina, general manager, Mobile Systems Division, NEC Electronics. “We were impressed with how easily we were able to integrate TTPCom’s solutions with our own to develop dual mode 3G/2G baseband LSIs. This has accelerated the delivery schedule for the chips and will have a significant impact on our ability to increase our presence in the global market.”
Kiyohide Ikeda, Country Manager TTPCom Japan added, “With a longstanding involvement in the GSM market and in Japan, TTPCom is an ideal partner for companies looking to develop dual-mode products for the worldwide mobile market. NEC Electronics will benefit from the proximity of a support team in Japan, and we look forward to a long and fruitful relationship.”
About TTP Communications plc
Based in Cambridge, UK, TTP Communications plc (LSE: TTC) through its subsidiary
TTPCom Limited, develops intellectual property used in the design and manufacture of wireless communication terminals. TTPCom licenses its technology to leading semiconductor and terminal manufacturers worldwide, including Analog Devices, Intel, LG, Renesas, Sharp, Siemens and Toshiba. TTPCom has established an industry standard with its GPRS platform, offers EDGE, 3G, Wireless LAN and Wireless PAN solutions and, for those manufacturers for whom a fast time to market is critical, TTPCom also offers complete handset and module designs. Over 40 million devices using TTPCom technology were shipped during 2004. More information can be found on TTPCom’s website at: http://www.ttpcom.com.
About NEC Electronics
NEC Electronics Corporation (TSE: 6723) specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets, system solutions for the mobile handsets, PC peripherals, automotive and digital consumer markets, and platform solutions for a wide range of customer applications. NEC Electronics Corporation has 26 subsidiaries worldwide including NEC Electronics America, Inc. (www.necelam.com) and NEC Electronics (Europe) GmbH (www.ee.nec.de).
For further information, please visit the NEC Electronics home page at: www.necel.com
Contact
Allan Edwards Peter Davies
Neesham Public Relations TTPCom Limited
Tel: +44 (0) 1442 879222 Tel: +44 (0) 1763 266266
Email: allane@neesham.co.uk Email: peter.davies@ttpcom.com
Sophie Yamamoto
NEC Electronics Corporation
Tel: +81 44-435-1676
Email: sophie.yamamoto@necel.com