Total domestic shipments of mobile phone handsets in February surged 16.0 pct from a year earlier to 5.02 mln units, data from the Japan Electronics and Information Technology Industries Association (JEITA) showed. Shipments of PHS handsets surged 172.2 pct to 157,000 units, rising for the 13th straight month, according to the report.
Omron has announced that RFID inlay manufacturing capacity will be increased to support production of more than 250 million inlays per year at its Minakuchi factory in Shiga, Japan. This factory location was chosen to take advantage of its more than 30 years of experience with semiconductors and class 10000 clean room standards. The company will continue to add inlay production capacity to further increase annual production above 350 million inlays within the next 12 months.
NEC Corporation today announced that its High Speed Down link Packet Access (HSDPA) is to be deployed in the 3G network of 3 Hong Kong, a subsidiary of Hutchison Telecommunications (Hong Kong) Limited. This contract has been awarded to NEC and its 3G partner Siemens following a successful field trial on 3 Hong Kong’s UMTS network. During the field trial, NEC’s HSDPA-based UTRAN achieved a high level of performance and functionality, including high-speed internet access, consecutive data transmission and handover in a HSDPA service environment, while allowing flexible and variable changes in transmission speed.
NEC LCD Technologies today announced that it will begin shipping samples of its new 3.5-inch (8.9-centimeters-diagonal) amorphous silicon thin-film-transistor (TFT) liquid crystal display (LCD), part number NL2432HC22-40A, in the beginning of June. The new LCD is extremely suitable for installation in various portable devices such as personal digital assistants (PDAs) and portable GPS terminals as it can reproduce colors clearly and vividly even in indoor/outdoor environments with high ambient light.
EAccess Ltd. said on Wednesday its mobile unit will raise 42 billion yen ($359 million) from issuing new shares, while the unit has also secured a 220 billion yen credit line from banks. Under the agreement, the mobile unit, eMobile Ltd., will issue new shares totaling 28 billion yen on April 25. EAccess is one of three firms to be awarded mobile licences by the Japanese government last year. The deal is the largest nonrecourse project-finance loan in Japan for a company whose services have not begun yet, according to EAccess.
Vodafone Group Plc’s Japanese unit named Softbank Corp. President Masayoshi Son as a director. President Bill Morrow, who was sent by Vodafone Group a year ago to rebuild the company, will remain on the board.
