Network Technology
Network Technology

Network Technology

Nortel and Qualcomm Trial HSUPA

Option’s announced that they have successfully completed the industry’s first demonstration of live HSUPA (High Speed Uplink Packet Access) data card calls reaching a wireless uplink transmission rate of 1.3 Mbps and a wireless downlink of 2.7 Mbps at application level. A laptop fitted with an Option HSUPA data card (category 3 in uplink, cat 6 in downlink) based on QUALCOMM Mobile Station Modem MSM7200 chipset and commercial HSDPA/HSUPA network equipment from Nortel were used to achieve the new record data speeds. Commercial availability of “HSUPA-Ready” and full HSUPA products from Option are planned for the first half of 2007.

Strix Wins Big Japanese Mesh Deal

WiFi mesh startup Strix Systems Inc. has scored one of the largest multi-city 802.11 municipal deals yet announced, working with an NTT Group subsidiary to unwire a hundred cities in Japan over the next couple of years. The firm is working with NTT West and Network Value Components to deploy the network, which will use Strix’s Access/One OWS and IWS modular mesh products to provide voice, video, and data services in both indoor and outdoor settings. Nan Chen, Strix’s VP of marketing, says that the network could cover “about 50 million people” by the time it is completed, although he’s not sure which cities NTT plans to include in the deployment.

DoCoMo and HP Announce Sensor Platform

NTT DoCoMo and Hewlett-Packard just announced they have been conducting joint research with the goals of developing a new application platform to interconnect cellular telephone systems and sensor networks and the development of a prototype of new middleware platform. Designed to work with networks found in homes and businesses that utilize sensors relying on a variety of transmission methods the Sensor Network Middleware Platform enables interactive communication between those networks and mobile phones.

Solectek Chooses Fujitsu WiMAX

Solectek Corporation has selected the MB87M3550 Fixed WiMAX SoC from Fujitsu Microelectronics as the standard silicon for integration into its new WiMAX-compliant series of SkyWay-MAX base stations and subscriber units. The SkyWay-MAX system will be available in limited quantities at the end of 2006, and will be generally available during the first quarter of 2007.

Renesas Ships Sample SH-Mobile G2 Chips

Renesas Technology Corp. today announced that it has begun shipping samples of the SH-Mobile G2, a single-chip LSI for dual-mode HSDPA/W-CDMA and GSM/GPRS/EDGE mobile phones. The LSI was jointly developed with NTT DoCoMo, Inc., Fujitsu Limited, Mitsubishi Electric Corporation, and Sharp Corporation, and evaluation samples have been shipped to these handset manufacturers since the end of September 2006. Renesas plans to begin volume production of the SH-Mobile G2 in the third quarter of 2007 and will offer the W-CDMA mobile phone platform worldwide to W-CDMA and FOMA handsets.

DoCoMo Announces HSDPA Data Card

NTT DoCoMo announced today that starting September 29, they will market the FOMA M2501 HIGH-SPEED PCMCIA Type II data card [ .jpg image ] for speedy mobile packet transmissions with PCs. Downlink speeds of up to 3.6Mbps are available in HSDPA service areas in Japan. The card works on W-CDMA, GSM and GPRS networks.