eMobile Trials HSPA & LTE Combo
Qualcomm announced that it is sampling the industry’s first chipsets for dual-carrier HSPA+ and multi-mode 3G/LTE. According to the PR, these chipsets demonstrate significant progress toward enabling the mass-market commercial deployment of two next-generation network technologies that bring more advanced data capabilities to mobile devices for new global markets.

Congrats to KDDI for “au Smart Sports” winner of 3G CDMA Industry Achievement Award for Innovation in Consumer Entertainment Service