TTPCom and NEC Collaborate to Develop Dual-mode 3G/2G Chips
TTP Communications and NEC Electronics Corporation, the leader in single-mode (W-CDMA) 3G baseband chips in Japan, today announce that they are joining forces to develop dual-mode chips that will include TTPCom Limited’s EDGE/GPRS/GSM silicon and software architecture. This fast-track route to the development of 3G/2G chips will help NEC Electronics increase its presence in the global market. NEC Electronics is developing a dual-mode 3G/2G chipset to address the growing world market for dual-mode wireless products that can handover to EDGE/GPRS/GSM networks outside pockets of 3G coverage.