Texas Instruments and DoCoMo JV
Fulfilling a commitment made last year to jointly develop 3G solutions with NTT DoCoMo, Texas Instruments Inc. today announced it has sampled a cost-competitive, multi-mode UMTS chipset developed with NTT DoCoMo to serve the worldwide 3G handset market. Part of TI’s OMAP-Vox architecture, the new OMAPV2230 solution is an integrated UMTS dual-mode digital baseband processor and advanced applications processor based on TI’s high-performance OMAP 2 architecture, TI’s proven GSM/GPRS technology, and NTT DoCoMo’s established WCDMA technology.
This 3G collaboration builds upon this long-standing relationship between TI and NTT DoCoMo and further strengthens TI’s lead in the 3G marketplace. With more than 15 million 3G subscribers, NTT DoCoMo is the worldwide leader in this growing 3G marketplace. To date, the majority of NTT DoCoMo’s 3G FOMA handsets have benefited from TI’s OMAP processor technology to provide FOMA subscribers with advanced applications and services.
“The new OMAPV2230 solution will help NTT DoCoMo expand its 3G FOMA subscriber base by offering more affordable 3G handsets with the most advanced multimedia applications allowing a richer user experience with mobile digital TV, music and gaming,” said Koji Chiba, Managing Director of Customer Equipment Development Department, NTT DoCoMo. “NTT DoCoMo is pleased to achieve this next step in our 3G collaboration with TI. With our combined best-in-class systems expertise, NTT DoCoMo and TI have developed the cost- efficient OMAPV2230 to drive widespread adoption of 3G phones delivering high- performance multimedia applications.”
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