DoCoMo: New 3G Plans for USA UPDATE
At yesterday’s regular press conference, DoCoMo president Keichi Tachikawa managed to confirm most of what we wrote about last week in our viewpoint DoCoMo: New 3G Plans for USA? Most importantly, someone in the U.S. is still obligated to roll out W-CDMA because this was grandfathered into DoCoMo’s original contract with AT&T. Tachikawa said yesterday that the phones have already been ordered! We’ll have more details on Monday.

An exclusive interview with Shusaku Muruko, senior manager of Sony’s Mobile FeliCa Business Division, providing insight on how the FeliCa contactless IC chip (now being trialed on NTT DoCoMo handsets) will soon consign traditional leather wallets to the gomibako of history. In a speech last week, DoCoMo’s “Mr. i-mode,” Takeshi Natsuno, officially confirmed that FeliCa chips will be embedded in this summer’s 506i second-generation handsets — and likely in the next round of FOMA 900i-series 3G handsets as well. With FeliCa mandatory on all new DoCoMo cellies from this summer on, and with crucial partners including KDDI and JCB already on board, FeliCa m-payment technology has a very good chance, we think, of reaching the company’s 60-million-user target for Japan by 2008. If you’re hoping to sell anything via mobile anywhere on planet Earth, this program is a must-see. Full Program Run-time 13:38