Epson and Renesas Develop New Open-Standard for the Mobile Video Interface
Seiko Epson Corporation and Renesas Technology Corporation have jointly developed standard specifications for the Mobile Video Interface, a high-speed serial interface designed specifically for text and graphics displayed on mobile communications devices. Now that they have completed the new standard, the two companies have decided to make it an open standard. Epson and Renesas Technology believe that the dissemination of the new standard will ensure even simpler architecture for the high-speed data transmissions required of next-generation mobile equipment such as mobile phones.
This recently established specification will be made available on a license-free basis, not only to mobile applications developers, mobile device makers, and other mobile industry-related participants but also to other semiconductor manufacturers, in hopes of enlisting partners from major companies to help accelerate this new interface’s market dissemination. It will also contribute to greater battery life, reduced EMI noise, and will make mobile equipment easier to use.
Features of the Mobile Video Interface
Mobile Video Interface is a high-speed serial interface for connecting devices built into mobile phones and other mobile communications products. As an open standard, it enables various kinds of added value for users to be designed into next-generation mobile phones.
Mobile Video Interface includes eight physical signals: CLK +/-, DTO +/-, STB +/-, and DTI +/-. In the case of a mobile communications device that contains both a main LCD and sub LCD, this interface – which has six interface lines as opposed to the 40-lines on conventional interfaces – can control both the main and sub LCDs. The main features of the Mobile Video Interface (Rev.1.0) are listed below.
The push to disseminate the Mobile Video Interface
The details of the Mobile Video Interface will be announced steadily as these two companies launch their market-oriented campaign to enlist partners from among the major players in Japan and overseas around the world. The framework of these partnerships are described in Attachment 2.
Mobile Video Interface road map
The first products will use the Mobile Video Interface Rev. 1.0 to link LCDs. In the fourth quarter of 2004, products that link cameras via this interface are due on the market, and in the first quarter of 2005 products with baseband links are expected. Mobile Video Interface Rev. 2.0, which will support data transfer at up to 400 Mbps, is scheduled for release in the second quarter of 2005.
Main features of the Mobile Video Interface (Rev.1.0)
1. Simple circuit configuration
Basic configuration with 8 physical signals (maximum cable length is 20 cm) Single-edge synchronized clocking method for data transfer Circuit configuration eliminates need for PLL circuit on target side 8B/10B code is used to enable detection of communication circuit errors This standard applies only to the physical layer, which gives applications design freedom at higher layers
2. High-speed data transfer
Up to approximately 200 Mbps per channel (200 Mbps max per channel in both directions) Even faster data transfer can be implemented by increasing the number of channels (approximately n x 200 Mbps max per channel n channels) Supports both full duplex and half duplex. When communications are mostly unidirectional, use of half-duplex mode can further reduce the number of physical signals used. Data transmit clock on target side can be divided to enable selection of the optimum transfer rate for the target side’s operations.
3. Low power consumption and low EMI noise
Current drive type LVDS is used to reduce power consumption and EMI noise. Equipped with power-down and wake-up functions to save power when device is not in use.
Partnership framework
1. Core members
Core members have the final say on the specification and have voting rights concerning the admission of any new core members. (Core members: Epson and Renesas Technology)
2. Partners
Partners are able to exchange views with core members, and they are entitled to announce their candidacy for core membership. They are also able to purchase a design kit that includes a design manual explaining how the standard will be implemented.
3. SIG (Special Interested Group)
SIG members are able to obtain the standard.
About Renesas Technology Corp.
Renesas Technology Corp. designs and manufactures highly integrated semiconductor system solutions for mobile, automotive and PC/AV markets. Established on April 1, 2003 as a joint venture between Hitachi, Ltd. (TSE:6501, NYSE:HIT) and Mitsubishi Electric Corporation (TSE:6503) and headquartered in Tokyo, Japan, Renesas Technology is one of the largest semiconductor companies in the world and the number one microcontroller supplier globally. Besides microcontrollers, Renesas Technology offers system-on-chip devices, Smart Card ICs, mixed-signal products, flash memories, SRAMs and more. For further information, please visit the Renesas Technology Corp. home page at: www.renesas.com/eng/
Renesas Technology Corp.
Motokazu Isozaki
+81-3-6250-5555
isozaki.motokazu@renesas.com
About Seiko Epson
Seiko Epson is an electrical equipment maker which recently listed on TSE1. The company has strength in printers and other hardware. For further information, please visit the Seiko Epson home page at: www.epson.co.jp
Contact
Seiko Epson Corporation
Corporate Communications,
+81-266-58-1705 or +81-3-3340-2637
http://www.epson.co.jp/e/