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Archives

September 8, 2004

New 3G Memory Design Announced

Three of Japan’s major electronics manufacturers have agreed on a standard interface specification for a type of memory in 3G mobile phones that will allow the companies to use a common component design to help phones function better. The companies will begin production of memory parts based on the specification in March 2005, according to a statement.

Fujitsu, NEC Electronics and Toshiba have agreed on interface specifications for pseudo static random access memory (PSRAM) that will allow them to freely use each other’s production of memory in mobile phones.

NEC, Toshiba, and Fujitsu make mobile phones for the Japanese domestic market, while NEC also makes mobile phones for overseas markets.

The specification is called Common Specifications for Mobile RAM (COSMORAM) Rev. 3. It follows several agreements between the manufacturers to cooperate on memory standards for mobile phones. Full story Here.

Related posts:

  1. Toshiba Announces Latest Strategic Memory Roadmaps
  2. NEC’s 128MB for Mobile
  3. Toshiba to Boost Memory Output
  4. World First 8GB SDHC Memory Card
  5. Toshiba Pushing NAND Memory

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