Qualcomm announced that it is sampling the industry’s first chipsets for dual-carrier HSPA+ and multi-mode 3G/LTE. According to the PR, these chipsets demonstrate significant progress toward enabling the mass-market commercial deployment of two next-generation network technologies that bring more advanced data capabilities to mobile devices for new global markets.
Qualcomm is working with numerous network operators, infrastructure vendors and device manufacturers with its dual-carrier HSPA+ and/or LTE solutions. Among multiple network operators evaluating the new technologies are Japan’s EMOBILE Ltd. and Telstra Wireless. Qualcomm is also working with multiple infrastructure vendors, such as Huawei Technologies and Nokia Siemens Networks, to perform interoperability tests for dual-carrier HSPA+ and LTE. Among the many device manufacturers currently evaluating the new chipsets are Huawei, LG Electronics, Novatel Wireless, Sierra Wireless and ZTE.
Dual-carrier HSPA+ and LTE are network innovations that provide the ability to deliver more advanced data capabilities to mobile devices, supporting more compelling applications and richer user experiences. A wide variety of network operators, infrastructure vendors and mobile device manufacturers are now working with Qualcomm to enable the deployment of these next-generation network technologies in new markets worldwide. Interoperability testing with infrastructure partners is already underway with multiple field trials scheduled for the first half of next year. Commercial launches of data-centric devices based on Qualcomm’s MDM solutions are expected to begin during the second half of 2010.