DoCoMo, Renesas, Fujitsu and Sharp announced that they plan to jointly develop the SH-Mobile G4 single-chip LSI device, and a platform incorporating it, to support the HSUPA1/HSDPA2/W-CDMA and GSM/GPRS/EDGE (2G) mobile telephony standards. DoCoMo and Renesas began joint development work in 2004 on the SH-Mobile G series of single-chip LSI devices, which integrate a baseband processor that supports dual-mode communication and an application processor. The SH-Mobile G4 will be the fourth product to emerge from this collaboration.

The new SH-Mobile G4 will be fabricated with 45-nm process technology to enable highly integrated functions and extra-fast processing. It will provide enhanced functionality and improved performance for applications handling HD3 video and 3-D graphics. In addition to HSDPA cat.8 for extra-fast downlink speeds (max. 7.2 Mbps), the SH-Mobile G4 will support HSUPA to boost uplink speeds to a maximum of 5.7 Mbps, almost 15 times faster than the conventional 384kbps speeds, thereby enabling much faster bidirectional data transfers. Renesas plans to provide the platform to the worldwide mobile phone market, in addition to customers in Japan. Development of the platform is targeted for completion by the fourth quarter of fiscal 2009.

Related posts:

1. Global 3G Platform Announced
2. Renesas Ships Sample SH-Mobile G2 Chips
3. DoCoMo Announces New 3G Platform JV
4. Renesas Starts Sample Shipments of Dual-Mode Chips Developed With NTT DoCoMo
5. DoCoMo to Invest in FOMA Single-Chip LSI

Some sage advise when entering new turf; Stop, Look and Listen.. it’s also good to secure a local guide. Japan is the cradle of mobile civilization – we have been dedicated to this space since 2001 – trust our archives here offer some useful material.

Domestic activities continue to set the pace, and sharp players are looking at global markets. We have hard-earned industry expertise and trusted network of contacts with access to advanced intell. and potential deal flow. Need a lift.. Ok, buckle-up!