MediaFLO and 1Seg Multi-Mode TV Tuner

Qualcomm announced that it has successfully demonstrated the capability to support the MediaFLO and ISDB-T (1Seg) mobile TV standards on a multi-mode handset. Powered by their Universal Broadcast Modem — UBM — chipset, “the technology illustrates that MediaFLO technology can complement the free-to-air standard used in Japan and Brazil to enable a mix of free and paid mobile broadcast content and services to drive consumer adoption and revenue.” See our video interview with MediaFLO recorded here in 2006.

The MediaFLO mobile broadcast platform enables the delivery of television content as well as value-added audio, video, data and interactive services and provides a means for broadcasters and operators to augment and monetize their existing International ISDB-T services. By employing both complementary technologies in a combined service offering, broadcasters and operators can offer free-to-air content using International ISDB-T, while providing a large number of pay TV channels and enhanced services over the MediaFLO platform to generate subscription revenue. As Qualcomm supports both mobile TV technologies on a single chip, handset OEMs can achieve economies of scale in producing multi-mode, TV-enabled phones without incurring a significant increase to their bill of material costs.

“To date, the mobile broadcast deployments in Asia have been successful in driving handset adoption, but so far have not generated a strong return on investment for the mobile TV service providers,” said Neville Meijers, senior vice president and general manager of Qualcomm MediaFLO Technologies. “Demonstrating MediaFLO and International ISDB-T standards on a single, multi-mode handset illustrates a clear path for monetizing mobile TV services through a hybrid free / pay TV service offering that leverages the popularity of free TV with the revenue potential of subscription-based content and value added services.”

Demonstrations at the Qualcomm booth A4 at the Tela Viva Movel conference in Sao Paulo, May 13-14 and at the Qualcomm booth C401 at the ExpoComm Japan show in Tokyo, July 22-24th.

Posted: 13 May 2008 | Filed: New Tech & Services, Wireless News | Feedback | Print |