Renesas Technology Corp. today announced that it has begun shipping samples of the SH-Mobile G2, a single-chip LSI for dual-mode HSDPA/W-CDMA and GSM/GPRS/EDGE mobile phones. The LSI was jointly developed with NTT DoCoMo, Inc., Fujitsu Limited, Mitsubishi Electric Corporation, and Sharp Corporation, and evaluation samples have been shipped to these handset manufacturers since the end of September 2006. Renesas plans to begin volume production of the SH-Mobile G2 in the third quarter of 2007 and will offer the W-CDMA mobile phone platform worldwide to W-CDMA and FOMA handsets.

The second generation product in the SH-Mobile G Series, the SH-Mobile G2 aims to accelerate the global adoption of W-CDMA services such as FOMA and to reduce the cost of these handsets. To provide a complete platform solution to these markets, the SH-Mobile G Series combines a dual-mode baseband processor and the SH-Mobile application processor in a single chip. Since the first generation SH-Mobile G1, which was jointly developed with NTT DoCoMo for W-CDMA and GSM/GPRS handsets, the SH-Mobile G2 was developed together with three additional handset manufacturers to deliver enhanced technology and additional functionality.

For example, the SH-Mobile G2 supports HSDPA and EDGE handsets and achieves a faster transfer rate of 3.6 Mbps. The SH-Mobile G2 is available with a complete mobile phone reference platform that combines software, such as an operating system, middleware, and drivers, as well as common hardware such as a power supply IC and a RFIC. At the same time, it will reduce development time and cost, allowing manufacturers to dedicate resources for developing handsets with superior features.

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3. Intel Japan Ships Sample 3G Chips
4. DoCoMo Announces New 3G Platform JV
5. DoCoMo & TI to Develop Multi-Mode UMTS

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