Philips Electronics announced a new low-power 802.11g wireless LAN semiconductor system-in-a-package (SiP) solution for the mobile phone market. The new low-power 802.11g solution enables consumers to access voice, data and multimedia content through WLAN networks up to five times faster than current 802.11b products on the market without compromising the battery life of the mobile phone. 

The solution is claimed to significantly reduce receive and transmit operating power consumption. Continue >>

Related posts:

1. Philips Introduces New Bluetooth Solution
2. Atheros Communications Introduces First Single-Chip Cellular Solution
3. KDDI Announces Mobile WLAN Systems
4. Radvision’s PC-to-Mobile 3G Solution
5. Toshiba Unveils Gigabit WLAN

Some sage advise when entering new turf; Stop, Look and Listen.. it’s also good to secure a local guide. Japan is the cradle of mobile civilization – we been been dedicated to this space since 2001 – trust our archives here offer some useful material.

Domestic activities continue to set the pace, and sharp players are looking at global markets. We have hard-earned industry expertise and trusted network of contacts with access to advanced intell. and potential deal flow. Need a lift.. Ok, buckle-up!