Share
Monthly Archives:

  • Fujitsu Partners to Offer All-CMOS Single-Chip Wireless USB

    Fujitsu Limited and Staccato Communications, Inc. announced a partnership under which they will provide all-CMOS, single-chip wireless universal serial bus (USB) and ultra-wideband (UWB) solutions for the global marketplace. CMOS single-chip wireless USB products are compliant with Multiband OFDM Alliance (MBOA) UWB specifications. Sampling of these chips from Fujitsu and Staccato Communications is scheduled for 2005, moving the companies closer to volume production and commercialization of these chips, targeting the consumer PC, digital home appliance, and mobile phone markets. 

    “Integration is the key to competitive products. Having chosen Fujitsu’s advanced process CMOS technology from the outset, Staccato Communications is leading the industry with single-chip wireless USB solutions,” said Joji Murakami, Group Senior Vice President, LSI Group of Fujitsu Limited. “Fujitsu aims to achieve further integration of wireless USB functionality into ASIC system-on-chips (SoC), utilizing its design capabilities. By partnering with Staccato Communications, our goal is to provide customers with optimal wireless USB/UWB technology-based solutions.”

    Fujitsu will offer its SoC/ASSP together with Staccato Communication’s UWB products as part of its next-generation wireless USB/UWB technology-based solutions to its customers, enabling them to develop state-of-the-art products with wireless USB capabilities.

    “Perhaps one of the best decisions we have made at Staccato was our choice of Fujitsu’s process technology,” said Roberto Aiello, founder and CTO, Staccato Communications. “For digital-centric designs like wireless USB, Fujitsu’s process technologies and a rich set of libraries and IPs have tremendous advantages, and the real benefit is in how well Fujitsu’s process technology and libraries are optimized to handle high-speed RF circuit designs embedded along with the digital.”

    Fujitsu and Staccato Communications will leverage the partnership to deliver to their customers value-added, next-generation wireless USB/UWB technology-based solutions that comply with MBOA UWB specifications to mutually grow and promote the companies’ business in the wireless USB/UWB global markets.

    Posted: 6 January 2005 | Filed: Terminal Technology, Wireless News | Feedback | Print |
Double Your Chances of Business Success in Japan

Servcorp Serviced Offices and Virtual Offices
Related Posts:
  • QUALCOMM Introduces First Dual-Mode Chip for WCDMA and GSM/GPRS/EDGE

  • QUALCOMM Incorporated pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, today announced further steps to reduce development costs for WCDMA (UMTS) markets worldwide with...

  • Qualcomm Single-Chip, RF CMOS Transceiver

  • Qualcomm has announced what is said to be the industry's first single-chip CDMA2000 radio frequency CMOS transceiver with integrated receive diversity and simultaneous-GPS. The RTR6500 transceiver's integration of receive...

  • Fujitsu Intros World’s Smallest WiMAX Module

  • Fujitsu announced the launch of the world's smallest radio frequency module for mobile devices, which supports all of the RF circuitry necessary for Mobile WiMAX, the highly anticipated next-generation...

  • Chip Cuts Power Consumption 90%

  • Hitachi Ltd., a major electrical machinery manufacturer, and Renesas Technology Corp., a microcontroller producer equally owned by Hitachi and Mitsubishi Electric Corp., have developed system-chip technology that can reduce...

  • Atheros Communications Introduces First Single-Chip Cellular Solution

  • Atheros Communications, Inc., a leading developer of advanced wireless solutions, today announced the company's first cellular solution, the Atheros AR1900. In a single chip, the AR1900 implements a complete...


    previous post: Hitachi Wins 3G Order from KDDI :: next post: Hitachi Beats Samsung at KDDI - Comments