NTT DoCoMo, Inc. announced today that the company will invest in Renesas Technology Corp. to jointly develop a single-chip LSI making FOMA 3G handsets compatible with both W-CDMA and GSM/GPRS networks. Currently, it is necessary to embed two chips in the handset in order to produce a dual-mode W-CDMA and GSM/GPRS handset. However, by combining DoCoMo’s W-CDMA technology with Renesas Technology’s LSI fabrication capabilities, multimedia application processors, and GSM/GPRS technologies, a single-chip will be developed that enables a lower-cost 3G handset to run on both network standards.

DoCoMo said its investment is a step toward bringing about the widespread global use of 3G FOMA-compatible handsets incorporating low-cost chipsets which feature an array of power-efficient advanced functions. Enhanced chipsets will also enable the upgrading of basic FOMA handset functions, such as longer standby-time.

DoCoMo will provide a total of about 7 billion yen over three years (fiscal 2004 to 2006) to Renesas Technology.

Following up on this investment, DoCoMo plans to continue actively promoting research and development of 3G and mobile multimedia services in order to further enhance the value of these services to the user. Full Press Release Here.

Related posts:

1. Renesas Starts Sample Shipments of Dual-Mode Chips Developed With NTT DoCoMo
2. Single Chip LSI for Multi-Standards
3. Global 3G Platform Announced
4. Renesas Ships Sample SH-Mobile G2 Chips
5. DoCoMo Announces New 3G Platform JV

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