Philips Electronics launched a plug-and-play Bluetooth solution in a single chip package for applications such as mobile phones, headsets, car kits, and PDAs. The new Bluetooth solution, the BGB202 system-in-package (SiP), is said to be a breakthrough for designers of mobile devices through the integration of multiple technologies into one package, reducing the complete Bluetooth solution footprint to 56 sq mm. The BGB202 integrates everything needed for Bluetooth wireless technology functionality in one ultra-small format.

Housed in an HVQFN semiconductor package measuring only 7 x 8 sq mm, it reduces the number of required components enabling quicker design cycles, lower risk, simplified manufacturing and a reduced bill of materials. The BGB202 is a certified plug-and-play Bluetooth system with all the critical RF functions built-in. This results in an easier design-in as no RF-critical experience is required to add Bluetooth functionality. Continue >>

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4. QUALCOMM Introduces First Dual-Mode Chip for WCDMA and GSM/GPRS/EDGE
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Some sage advise when entering new turf; Stop, Look and Listen.. it’s also good to secure a local guide. Japan is the cradle of mobile civilization – we have been dedicated to this space since 2001 – trust our archives here offer some useful material.

Domestic activities continue to set the pace, and sharp players are looking at global markets. We have hard-earned industry expertise and trusted network of contacts with access to advanced intell. and potential deal flow. Need a lift.. Ok, buckle-up!